MDT Readout Overview

Updated 21 December 2000 hazen@bu.edu

• OVERVIEW

Overview of readout [GIF][PS] page

• ON-CHAMBER ELECTRONICS

The MDT chambers have electronics connected at both ends.  High Voltage is distributed at one end, while the signal readout occurs at the other end.  Each chamber has an associated "Chamber Service Module" which provides the interface between the chamber and the ATLAS DAQ system.
 
• HV End
• HV Hedgehog Board (A. Lanza at INFN Pavia)
  • Technical and Procurement pages
• HV Patch Panel (also by A.Lanza)
• HV Cabling
• Reaout End
• Faraday Cage

Each end of the chamber is completely enclosed by an aluminum shield.  Inside the "Faraday Cage" formed by this shield are the front-end readout boards.
• Board Stack Drawings
• Barrel Chamber Board Stack [GIF] [PS] [DXF]
• Signal Hedgehog Board
• 3x8 board by E. Hazen:  Technical Page and Procurement Page
• 4x6 board by E. Spiriti
• Side View Cartoon [GIF][PS]
• Mezzanine Board
• User Documentation

HERE for 3-layer version. (see E.Spiriti for 4-layer version)
• ASD Chip

Octal Amp, Shaper, Discriminator developed by Harvard, Boston U
See Development Info Page.
• TDC Chip

is a joint development of CERN and KEK
see specification in papers archive
• Control ASIC

provides JTAG control of ASD and TDC parameters
• Voltage Regulation
• Signal Patch Panel
• Signal Cabling
• 36-Pin connector info Wiring Diagram [GIF][PS]
• Chamber Service Module (CSM)
• FE-Link Multiplexor
• TTC Receiver and Clock Distribution
• JTAG Control Interface
 
• OFF-CHAMBER ELECTRONICS

Data is transmitted over ~100m optical fibers to the USA-15 underground area.  There it is received by ROD (ReadOut Driver) modules, which transmit the data over ROL (ReadOut Link) optical fibers to the counting house on the surface.
 
• NIMROD

is the proposed ROD for the MDT system.
See NIKHEF page or the NIMROD specification in our papers archive